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“The octopod sperm is unique especially in two aspects: the screw-shaped acrosome and its inner layered substructure (striation). The present study aims to investigate morphological changes of Octopus tankahkeei spermatozoa during the acrosome reaction (AR) and to pursue functions of the internal substructures revealed by inducing AR with the calcium ionophore A23187. Gradual changes of the spermatozoa were traced using fluorescence and electron microscopy. Ferroptosis inhibitor drugs The AR process included the bulging, vesiculation,

and dehiscence of the plasma membrane around the acrosome and the nucleus, as well as the vesiculation of the mitochondrial sheath. Membrane vesiculation outside the nucleus has never been reported in the order Octopoda. The rigid screw and the inner striation of the acrosome remained intact surmounting the nucleus, suggesting that these two structures have potential functions during fertilization. In addition, the detachment of the sperm head and

the tail was commonly observed in this study, both in intact and acrosome-reacted sperm. Fluorescence microscopy revealed that the detached mitochondrial sheath usually gave weaker and more dispersive signals than the joint ones. This phenomenon implied that the intense Selleck Stem Cell Compound Library energy release might promote the detachment of the mitochondrial sheath. (C) 2009 Elsevier Ltd. All rights reserved.”
“As the power of electronic systems is increasing, thermal fluxes are getting higher, up to more than 100 W/cm(2) in the more critical cases. They result in hot spots with various consequences, especially performance https://www.selleckchem.com/products/sc79.html reduction and reliability issues. Most of the prior research has been focused on active liquid cooling and on reducing hot spots by the implementation of thermal interface materials (TIMs) and spreading solutions. The approach presented here is based on the implementation in silicon of nanocomposite structures including carbon nanotubes (CNTs) and phase change materials

(PCMs). The simulation model presented here shows how the composite CNTs/PCM structure efficiently reduces the temperature excursion at the silicon surface compared to the implementation of PCM only or a thicker silicon. A fabrication process flow is presented with a special focus on the assembly of silicon top and bottom parts with CNTs. Process conditions are explored to insure mechanical adhesion and thermal contact quality. This thermal interposer concept provides a new solution for thermal management and reliability improvement of devices. It is of great interest for electronic and optical devices, MEMS and 3D integration. (C) 2014 Elsevier B.V. All rights reserved.